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Encyclopedia of wafer cutting

Release time:2021-01-28 14:12:08 viewed: The publisher:admin

Chip cutting machine is a very precise equipment, its spindle speed is about 30000 to 60, Because the distance between the grains is very small (about 2mil, 1mil = 1 / 1000 inch) and the grains are very fragile, the precision requirement is very high (3 μ m in 205mm stroke), and the diamond blade must be used for cutting, and the cutting method is grinding to separate the grains. Because the grinding method is used for cutting, a lot of small powder will be produced, so in the process of cutting, it must be washed with clean water constantly to avoid polluting the grain. In addition to the above points, there are a lot of things to pay attention to in the whole cutting process, such as the grains need to be completely divided, but the bearing tape can not be cut, the cutting line must be along the grain and the grain, and the grain collapse or crack can not be caused after cutting, etc. In order to solve the above problems, all kinds of automatic detection, automatic adjustment and automatic cleaning equipment will be applied to the machine to reduce the loss caused by cutting errors. Figure 1 is an example of a chip cutting machine. The cut wafer is then transferred to the next process for bonding.

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