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Foreign media sharing of wafer cutting machine

Release time:2021-01-28 14:09:26 viewed: The publisher:admin

We get the latest news from Silicon Valley: silicon cutting machine, also known as silicon laser cutting machine, laser dicing machine. It is a new application of laser dicing machine in cutting silicon substrate in electronic industry. Laser scribing is the use of high-energy laser beam irradiation on the surface of the workpiece, so that the irradiated area is local melting, gasification, so as to achieve the purpose of scribing. Because the laser is focused by a special optical system into a very small light spot, high energy density, because its processing is non-contact, there is no mechanical impact on the workpiece itself, the workpiece is not easy to deform. It is widely used in the cutting and scribing of solar panels and thin metal sheets.

Laser dicing machine is mainly used for dicing and cutting of metal materials, silicon, germanium, gallium arsenide and other semiconductor substrate materials. It can process solar panels, silicon, ceramics, aluminum foil, etc. the workpiece is fine and beautiful, and the cutting edge is smooth. A Nd: YAG laser with acousto-optic Q-switch is used as the working light source. The two-dimensional stage is controlled by a computer, and it can move according to the input figure. It has the advantages of high output power, high precision and high speed. It can cut curves and straight lines.


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