With the rapid development of science and technology, the quality requirements of electronic components are higher and higher. In order to improve the quality of products, strict control is needed from the design, production, inspection, transportation and use of all aspects. In the production of SAW devices, the high quality and high efficiency of each process is the premise of the efficient operation of the whole production line. As the first link of the next process, the quality and efficiency of the grinding wheel dicing process directly affect the quality of the final product and the yield and production efficiency of the whole production line. Its importance is more and more obvious.
The main problem of dicing machine with grinding wheel: the material used in semiconductor industry is hard and brittle, which is different from ordinary grinding. After many experiments, we get the following conclusions: (1) when the spindle speed and cutting depth are fixed, the cutting feed speed decreases and the cutting path width decreases. (2) When the cutting feed speed and cutting depth are fixed, the spindle speed increases and the cutting path width decreases. (3) The width of the cutting path in the forward cutting mode is smaller than that in the reverse cutting mode. Low cutting force and small cutting path width can be obtained by using in-line cutting, slow cutting feed speed, small cutting depth and high spindle speed. (4) Due to the influence of blade thickness, blade passivation or unsuitable feed speed, axial vibration of cutting machine and other phenomena, the width of cutting path will become larger. (5) The unsuitable operation mode, blade type, cutting condition, vibration size, workpiece material and cutting parameters may be the factors that cause excessive substrate rupture.
The cutting principle of hard and brittle materials is significantly different from that of metal materials. Hard and brittle materials have high hardness and brittleness, and their physical and mechanical properties, especially toughness and strength, are quite different from those of metal materials. Generally, hard and brittle materials use fracture toughness and fracture strength to express material properties. The principle of material removal can be divided into brittle fracture and plastic deformation. Generally, the removal of brittle fracture is accomplished by the formation or propagation of voids and cracks, spalling and fragmentation. The removal of plastic deformation is similar to the chip forming process in metal grinding, including scratch and chip formation. The material is removed by shear chip formation. In the brittle failure mode, the crack occurs near the contact boundary behind the abrasive grains, and grows laterally to form a crack. In the plastic deformation, the plastic region expands in front of and below the abrasive grains to form a shear zone, and chips are produced to remove the material to obtain a better surface state.